Optimizing System PIM

At Advanced Circuitry International, we strive for 100% Repeatability and Consistency.

Which is why we have a great track record keeping control of Passive Intermodulation (PIM) within our processes.

We understand that our customers systems rely on very low levels of Passive Intermodulation and Minimal Interference. Testing for PIM usually requires Antenna evaluation at a cell site. By advanced processing and testing, carefully selecting materials, validated process controls, with proper design practices and understanding, excellent PIM can be consistently achieved.

“A number of factors affect PIM in the transmitting side of a base station.

The presence of ferrous metals or other magnetic materials in the electromagnetic field near the antenna can significantly increase PIM.

Imperfect connections, such as conductive particles or chipped plating on the mating surfaces of conductors are a frequent cause. When designing and utilizing PCB antennas, it is important to remember PIM is not a basic laminate property. Just like insertion loss, gain, directivity, and many other important electrical variables, PIM is a system property that depends highly on the system design. However, our research has determined the laminate properties that can help contribute to low PIM variables.

Antenna designers know minimizing current density is key to achieving a low PIM system.

On the laminate side, we determined high conductor purity and low conductor profile, dielectric formulation and physical properties, as well as control of the conductor-dielectric interface can be controlled properly to minimize PIM generation.”


Factors to Optimize System PIM
Published: 02 August 2016
by Al Horn III
http://pcdandf.com/pcdesign/index.php/editorial/menu-features/10989-materials-1608