RF & Microwave PCB’s

ACI is a leader in providing complex RF/Microwave PCB’s covering a wide spectrum of product types including Defense/Aerospace, Medical Device, Imaging, and Telecommunications Equipment.

ACI supports a wide range of frequency bands and has a vast amount of experience utilizing low loss laminates. From multilevel cavity fabrication for vertical and horizontal RF connector launch sites to exotic material composite structures we’re confident delivering reliable and cost efficient products.

 

We offer the following expertise and depth of experience:

  • Vast Teflon processing experience
  • Exposed internal cavity RF launch sites
  • OhmegaPly™ & Ticer™ buried resistor technology
  • Precision stub length removal
  • Blind & buried via structures
  • Filled vias and via-in-pad structures
  • Composite multilayers using exotic materials
  • Sequential lamination
  • Castellated vias
  • Precise conductor etching
  • Prototypes to large scale production
  • +/- .0005″ tolerance on etched features for un-plated 0.5oz copper
  • +/- .001″ tolerance on etched features for un-plated 1oz copper
  • Front to back registration of etched cores to +/-.002″
  • Ormet interconnects
  • Multilevel cavity constructions
  • Edge Plating

We are always updating our technology offerings, please contact us to get the most current information.

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